| 摘要 |
PROBLEM TO BE SOLVED: To secure moisture resistance of a fingerprint sensor using an active matrix type TFT substrate. SOLUTION: Since a silicon resin or the like having fluidity is applied so as to cover a connecting part of a terminal group 30 of a pressure sensitive sensor integrated circuit chip 50 and an FPC170 through an opening part 193 formed in an upper lid 191 of a storage case storing the pressure sensitive sensor integrated circuit chip 50 to form a moisture-proofing agent layer 200, the moisture resistance can be secured, and the application region and amount of application of a moisture-proofing agent can be appropriately controlled. COPYRIGHT: (C)2006,JPO&NCIPI
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