| 发明名称 |
Compliant multi-composition interconnects |
| 摘要 |
A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein.
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| 申请公布号 |
US2005239275(A1) |
申请公布日期 |
2005.10.27 |
| 申请号 |
US20040832178 |
申请日期 |
2004.04.26 |
| 申请人 |
MUTHUKUMAR SRIRAM;DORY THOMAS S |
发明人 |
MUTHUKUMAR SRIRAM;DORY THOMAS S. |
| 分类号 |
H01L21/20;H01L21/44;H01L23/485;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
| 代理机构 |
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