发明名称 |
Electronic component facility for manufacturing electronic subassemblies and/or printed circuit boards uses a programmable device to position a boring head for chips |
摘要 |
<p>A freely programmable positioning device can position a boring head (14) at any point above a printed circuit board blank (10), at suitable points on which are applied level drilled holes, through-holes or milled holes (12), with their diameter and depth calculated so that 6 mm x 6 mm x 300 mu m radio frequency identification chips (18) completely fit the holes without protruding.</p> |
申请公布号 |
DE202005011948(U1) |
申请公布日期 |
2005.10.27 |
申请号 |
DE20052011948U |
申请日期 |
2005.07.29 |
申请人 |
ILFA INDUSTRIEELEKTRONIK UND LEITERPLATTENFERTIGUNG ALLER ART GMBH |
发明人 |
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分类号 |
H05K1/02;H05K1/18;H05K3/00;H05K3/30;H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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