发明名称 ADHESIVE TAPE STICKING CONDITION INSPECTION DEVICE AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive tape sticking condition inspection device and an adhesive tape sticking condition inspection method for improving efficiency of inspection work and securing inspection accuracy. <P>SOLUTION: In this adhesive tape sticking condition inspection for inspecting a sticking condition by imaging an adhesive tape 3 stuck to a base board by a camera, a first inspection frame 22 and a second inspection frame 23 are set respectively on the inside and the outside of a configuration line of the adhesive tape 3 stuck to an ideal position along longitudinal displacement limit lines L1a and L1b and width directional displacement limit lines L2a and L2b of the adhesive tape. Based on a result of detection of a part matching an identification condition identifying the adhesive tape from other parts inside the inspection frames, it is determined whether the adhesive tape is stuck in a good condition or not. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005301405(A) 申请公布日期 2005.10.27
申请号 JP20040112977 申请日期 2004.04.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ABE HISAKI
分类号 G06T1/00 主分类号 G06T1/00
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