VACUUM-PACKAGING METHOD OF MICRO-MACHINE ELEMENT, AND MICRO-MACHINE ELEMENT VACUUM-PACKAGED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of vacuum-packaging a micro-machine element by a simple process without leaking or discharging a gas into a package cavity where a micro-machine is to be packaged.

SOLUTION: The method of vacuum-packaging a micro-machine element includes steps of preparing an upper substrate 130 having a cavity formed and a lower substrate 125 having the micro-machine element formed, sealing them in a vacuum chamber, arranging the lower and upper substrates on an edge of the element on the lower substrate via an O-ring 150, and thereafter applying a pressure between the upper and lower substrates to have the O-ring pressure-bonded between the substrates. The method further includes steps of venting the vacuum chamber to an atmospheric pressure, vacuum-packaging the upper substrate and the lower substrate by a pressure difference between the vacuum and the atmospheric pressure, removing the pressure between the upper and lower substrates, and subsequently filling a sealant 270 between the upper and lower substrates outside the O-ring.

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