发明名称 IC CARD AND MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To propose a manufacturing method of an IC card capable of mounting an electrophoretic display device on an IC card while performing the moisture preventive treatment of the electrophoretic display device and the flatting of the surface of the IC card. <P>SOLUTION: The manufacturing method of the IC card K mounted with the electrophoretic display device 10 comprises steps of disposing a base material 61 having an opening part 61b for storing the electrophoretic display device 70 on an inlet 70 with the device 10 arranged thereon; and filling a transparent moisture-proof resin 21 in the opening part 61b so as to surround the upper part and circumferential side surface of the device 10 to form a moistureproof part 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005301795(A) 申请公布日期 2005.10.27
申请号 JP20040118840 申请日期 2004.04.14
申请人 SEIKO EPSON CORP 发明人 MIYAZAKI ATSUSHI;TAKAO HIROKI;KARAKI EIJI
分类号 B42D15/10;G02F1/167;G06K19/07;G06K19/077 主分类号 B42D15/10
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