| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a latent catalyst useful for epoxy resins, an epoxy resin composition which is good in hardenability and flowability and a semiconductor apparatus which is excellent in solder crack resistance and moisture-proof reliability. <P>SOLUTION: This latent catalyst for epoxy resins has a cation part which can promote the hardening reaction of epoxy resins and a silicate anion part which suppresses the activity promoting the hardening reaction. A preferable latent catalyst is shown in formula (1). The epoxy resin composition contains a compound having at least two epoxy groups in a molecule, a compound having at least two phenolic hydroxy groups in a molecule, the latent catalyst, and optionally an inorganic filler. [In the formula, A<SP>1</SP>is a nitrogen or phosphorus atom; R<SP>1</SP>-R<SP>4</SP>and Z<SP>1</SP>are each a substituted or unsubstituted organic group having an aromatic or heterocyclic ring or an aliphatic group; X<SP>1</SP>is an organic group; substituent Y<SP>1</SP>-Y<SP>4</SP>are each a group formed by the reaction that a proton-donating group releases a proton; X<SP>2</SP>is an organic group]. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
