| 摘要 |
PROBLEM TO BE SOLVED: To provide a stack-type electronic component having a plurality of electronic components, such as semiconductor elements, mounted in a stacked construction, adapted to suppress creation of bubbles attributed to unfilled voids of resin below wires to prevent defective insulation and short circuit caused by a touch between an electronic component on the upper layer side and the bonding wire of the electronic component on the lower layer side. SOLUTION: The stack-type semiconductor device 1 is provided with: a first semiconductor element 5 adhered onto a circuit board 2 through a first adhesive layer 6; and a second semiconductor element 8 adhered onto the first semiconductor element 5 through a second adhesive layer 9. The underspace below a first bonding wire 7 connected to the first semiconductor element 5 is filled with insulative resin 11 having a viscosity ranging from 1 Pa s or more to less than 1000 Pa s under filled-up conditions or with light-hardening insulative resin. The first and second semiconductor elements 5 and 8 are adhered together through an insulative resin layer 9 having a viscosity ranging from 1 kPas or more to less than 100 kPas under adhering conditions. COPYRIGHT: (C)2006,JPO&NCIPI |
