| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for semiconductor device, the manufacturing method thereof and a semiconductor device in which the connecting strength and the connecting reliability of solder ball are improved by connecting a connecting terminal to the solder ball through an opening on a land. SOLUTION: A pad 21b, the land 21a having an opening 22, and a solder resist layer 41 are formed on one surface of an insulating substrate 11 while an opening 13 for forming a solder ball is formed on the other surface of the same. An IC chip 71 is mounted on a substrate for semiconductor device, in the land 21a in the opening 42 of the solder resist layer 41 of which the connecting terminal 51 consisting of the solder is formed and the electrode of the IC chip 71 is connected to the pad 21b of the semiconductor device through wire bond connection. The IC chip 71 is sealed by a transfer mold through resin sealing, and ball-type solder is disposed to form the solder ball 61 through reflowing and obtain the semiconductor device. COPYRIGHT: (C)2006,JPO&NCIPI
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