| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the manufacturing of vertical wirings for a photoelectric conversion film lamination type solid-state image pickup device. SOLUTION: The method relates to manufacturing the photoelectric conversion film lamination type solid-state image pickup device in which a plurality of photoelectric conversion films, which are sandwiched between common electrode films and pixel electrode film supporting pixels, are laminated on a semiconductor substrate 1 via a dielectric. In the method, vertical wirings 37, 40 are manufactured previously and coated by an insulating material 65. The vertical wirings 37, 40 are connected to a signal reading circuit formed on the surface of the semiconductor substrate 1; pass through lower layer photoelectric conversion films, common electrode films that sandwich the photoelectric conversion films, and the dielectric; and are connected to the pixel electrode film that sandwiches the upper layer photoelectric conversion film. Then, the lower layer photoelectric conversion films, common electrode films sandwiching the photoelectric conversion films, and dielectric are laminated. This enables manufacturing vertical wirings without being broken and facilitates the lamination of the photoelectric conversion films or the like. COPYRIGHT: (C)2006,JPO&NCIPI
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