| 摘要 |
PROBLEM TO BE SOLVED: To obtain an excellent durability by eliminating a fracture of a copper wiring pattern at an early stage under the use of repetitive bending. SOLUTION: A printed wiring board 10 has a wiring pattern 12 made of copper on at least one face of a flexible insulating matrix 11 on a wiring pattern 2 located in a region 10A, where the printed wiring board 10 is used by bending out of the wiring patterns 12. A reinforcing conductive layer 13 made of softer metal than copper, for example, gold or silver is provided by plating, etc. COPYRIGHT: (C)2006,JPO&NCIPI
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