发明名称 |
Method of forming a support frame for semiconductor packages |
摘要 |
A semiconductor die package having an elastomeric substrate with a first support frame and a second support frame. The first support frame has a cavity within which a semiconductor die is placed. The second support frame may have an optional cavity. The optional cavity in the second support frame may have an optional rigid structure. The rigid structure may have a heating element formed within it.
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申请公布号 |
US2005236699(A1) |
申请公布日期 |
2005.10.27 |
申请号 |
US20050156732 |
申请日期 |
2005.06.21 |
申请人 |
CHAPMAN GREGORY M |
发明人 |
CHAPMAN GREGORY M. |
分类号 |
H01L23/495;H01L31/0203;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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