HEAT-RESISTANT PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERN FROM THE COMPOSITION, AND ELECTRONIC PART

摘要

A heat-resistant photosensitive resin composition which comprises (A) a polymer having an acidic functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine-derived functional group, (C) a photoreactive compound, and (D) a solvent. Due to this constitution, the composition gives a cured film having satisfactory properties. A pattern having satisfactory resolution can be produced from this photosensitive resin composition, and a high-quality electronic part can be provided with the pattern.