发明名称 MEMORY DEVICE WITH DIELECTRIC MULTILAYER AND METHOD OF MANUFACTURING THE SAME
摘要 <p>In a memory device including a dielectric multilayer structure, and a method of fabricating the same, the memory device includes a semiconductor substrate, a first impurity region and a second impurity region spaced apart from each other in the semiconductor substrate, and a gate structure formed on the semiconductor substrate and contacting the first impurity region and the second impurity region, the gate structure including a tunneling oxide layer on the semiconductor substrate, a charge storage layer on the tunneling oxide layer, an insulating layer on the charge storage layer, the insulating layer including at least two dielectric layers, and a gate electrode layer on the insulating layer.</p>
申请公布号 KR20050102864(A) 申请公布日期 2005.10.27
申请号 KR20040028165 申请日期 2004.04.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEON, SANG HUN;KIM, CHUNG WOO;HWANG, HYUN SANG
分类号 H01L21/8247;G11C16/04;H01L21/28;H01L27/10;H01L27/115;H01L29/51;H01L29/76;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 主分类号 H01L21/8247
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