发明名称 MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a mold assembly capable of reducing the lowering of a temperature due to a spacer to the utmost in a spacer for a manifold or a spacer for a valve casing. SOLUTION: The mold assembly is equipped with a fixed mold 1 and a movable mold 2 capable of being opened and closed and forming a cavity 3 at the time of being closed and the manifold provided to the fixed mold 1. The valve casing 52 is incorporated in the through-hole 41 formed to the fixed mold 1 so as to form a gap 62 through the spacer 61 along with the inner face of the through-hole 41. The spacer 61 for the valve casing 51 is constituted of a composite material composed of a ferrous metal sintered body 64 and a ceramic layer 65. The strength of the spacer 61 can be ensured and heat conductivity can be reduced. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005297455(A) 申请公布日期 2005.10.27
申请号 JP20040119530 申请日期 2004.04.14
申请人 MITSUBISHI MATERIALS CORP 发明人 HIGUCHI YOSHINORI
分类号 B29C45/28;(IPC1-7):B29C45/28 主分类号 B29C45/28
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