发明名称 EPOXY RESIN COMPOSITION
摘要 Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epo xy resin composition. The epoxy resin composition contains (A) one or more epox y resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000- 200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid.
申请公布号 CA2562936(A1) 申请公布日期 2005.10.27
申请号 CA20052562936 申请日期 2005.04.14
申请人 NAMICS CORPORATION 发明人 TERAKI, SHIN;SUZUKI, KENICHI;YOSHIDA, MASAKI;FUJINO, TAKU;YAMADA, TOSHIAKI
分类号 C08G59/62;H01L23/14;H01L23/498;H05K1/03 主分类号 C08G59/62
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