| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor device which can reduce manufacturing cost and manufacturing time and manufacturing method thereof in which the semiconductor substrate adhered to a supporting substrate is formed through the dicing-cut. SOLUTION: In the semiconductor element 40 and the manufacturing method thereof, after a semiconductor circuit is formed on a semiconductor substrate 30 deposited on a supporting substrate 10 via a bonding layer 20, a semiconductor element is formed through dicing-cut thereof together with the supporting substrate 20. A bonding layer 20 is formed using a bonding agent which loses an adhesive force under the temperature higher than the heating condition in the semiconductor circuit forming process. Otherwise, the bonding layer 20 is formed using a bonding agent which dissolves with the liquid under the temperature higher than the using temperature of chemicals used to form the semiconductor circuit. COPYRIGHT: (C)2006,JPO&NCIPI |
