| 摘要 |
PROBLEM TO BE SOLVED: To reduce the required film thickness of an Au plated layer to the utmost while preventing the oxidation of a Cu plated layer in a wiring board where the Cu plated layer and the Au plated layer for prevention of oxidation are formed in succession on the surface of wiring formed on one surface of a ceramic substrate. SOLUTION: The wiring board includes the ceramic substrate 10 and patterned wiring 20 formed on one surface of the ceramic substrate 10, and made of W or Mo, and there are formed subsequently a Cu plated layer 21 as a basic plated layer and an Au plated layer 23 on the surface of the wiring 20. In the wiring board, a Pd plated layer 22 made of palladium is interposed between the Cu plated layer 21 and the Au plated layer 23. COPYRIGHT: (C)2006,JPO&NCIPI
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