发明名称 LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a light emitting device structured to prevent arrival of oxygen or arrival of moisture at a light emitting element and its manufacturing method, and to seal up the light emitting element by a small number of processes without filling a desiccant. SOLUTION: This device has a first and a second substrates, wherein a pixel part having a plurality of light emitting elements having a first electrode and a second electrode formed on a layer containing an organic compound formed on the first electrode and a second electrode formed on a layer containing the organic compound. The second electrode is a conductive film having a light transmitting property. A CaF<SB>2</SB>layer, a MgF<SB>2</SB>layer or a BaF<SB>2</SB>layer is disposed on the second electrode, and a material having a light transmission property is disposed on the CaF<SB>2</SB>layer, MgF<SB>2</SB>layer, or BaF<SB>2</SB>layer. The first and second substrates are bonded with each other by the material having the light transmission property and at least either the first or second substrate has a light transmitting property. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005302740(A) 申请公布日期 2005.10.27
申请号 JP20050195934 申请日期 2005.07.05
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NISHI TAKESHI;NAKAMURA YASUO
分类号 H05B33/04;H01L51/50;H05B33/14;H05B33/26;(IPC1-7):H05B33/04 主分类号 H05B33/04
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