| 摘要 |
PROBLEM TO BE SOLVED: To provide a black plating film depositing method capable of uniformly depositing a black plating film on a surface of a work to be plated which is made of copper or a copper alloy. SOLUTION: A work to be plated which is made of copper or a copper alloy is immersed in an electroless plating bath of the liquid temperature being≤23°C for a predetermined time. The electroless plating bath contains nickel salt, thiouria-based compound, a tin (II) salt compound, and a chelating agent. COPYRIGHT: (C)2006,JPO&NCIPI
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