摘要 |
Disclosed is a printed circuit board that does not require an additional space for dummy lands for solder reservoirs and is capable of preventing short-circuiting caused by solder buildup. The area of each non-resist portion 22 expands gradually toward the back end of a land array in the dipping direction A, thus the area of solder deposition also expands in the region of the land array, thereby excessive solder does not remain up to the back end of the land array, and resultantly the amount of solder buildup at the backside in the dipping direction A can be reduced. Further, the present invention makes it unnecessary to dispose a dummy land for the prevention of solder buildup at the backmost portion of the land array, and thus the space used for a dummy land can be utilized effectively.
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