LIQUID TREATMENT DEVICE AND LIQUID TREATMENT METHOD

摘要

Treatment liquid supply nozzles (10) are individually arranged on both left and right sides of a semiconductor wafer (W) in a treatment vessel (1). A discharge opening of each of the nozzles (10) faces the semiconductor wafer (W). According to a predetermined procedure, a treatment liquid is discharged from one or more selected nozzles (10). To perform chemical liquid treatment, for example, first a chemical liquid is discharged from nozzles (10) on the lowermost positions, and then nozzles (10) for discharging the chemical liquid are sequentially changed to upper ones. To perform rinse treatment while the chemical liquid in the treatment vessel (1) is replaced with a rinse liquid, for example, first the rinse liquid is discharged from the nozzles (10) on the lowermost positions, and then the rinse liquid is discharged from all the nozzles (10). By this, liquid treatment is improved in efficiency and uniformity.