| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting composition useful for a solder resist for flexible print circuit boards and a protective coat for electroluminescent panels, having low hydrolyzability, excellent in solder heat-resistance, chemical resistance, adhesiveness, electric insulation and the like, having halogen-free stable flame-resistance, excellent in flexing resistance and causing little warpage after curing, and to provide a halogen-free cured film having stable flame resistance. SOLUTION: The thermosetting resin composition comprises (A) polycarboxylic acid resin having two or more carboxy groups in a molecule, 20-120 mgKOH/g acid value, -6 to 40°C glass transition temperature and 5,000-100,000 weight-average molecular weight, (B) a resin having two or more epoxy groups in a molecule, (C) a phosphamide compound represented by general formula (1) and (D) an organic solvent. Wherein, R<SP>1</SP>and R<SP>2</SP>are same or differently H or a 1-4C alkyl. COPYRIGHT: (C)2006,JPO&NCIPI
|
