| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro thin film pinhole mask which has yet been realized. SOLUTION: Assuming that film stress of Ni is 500 MPa, irrespective of the film thickness, and that the breakage limit of an independent thin film is 1 N/m in total stress, since the thin film reaches the breakage limit when its thickness becomes 2 nm, coating on one side is stopped at thickness of 2 nm or smaller. The coating on one side (front side) is finished at 1nm film thickness (total stress: 0.5 N/m), and then the coating is shifted to the back side. Similarly, the coating on the back side is likewise finished at 1nm film thickness. During this time, the maximum total stress, acting on the independent thin film, is 0.5 N/m which acts when finishing coating on the front side, and the total stress is 0 at the time of double-sided coat. Since the thin film can be coated with a 2 nm thick Ni in total up to here; thereafter when these processes are repeated 75 times, Ni coating of 150 nm thickness can be finished, while the state of maximum total stress of 0.5 N/m or smaller is kept, as it is. COPYRIGHT: (C)2006,JPO&NCIPI
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