| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing excellent in heat resistance, thermal cycle resistance, flame retardancy and continuous moldability including package staining, and an electronic part device sealed with the molding material. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin including an epoxy resin obtained by glycidyl etherification of a dimer of at least one of hydroxynaphthalene and dihydroxynaphthalene, (B) a curing agent comprising a compound represented by general formula (I), (C) a mixture of an epoxy resin represented by general formula (II) with an oxidized polyolefin and (D) an inorganic filler, where the content of the halogen-containing flame-retardant and the antimony-containing flame-retardant are each at most 0.1 wt% based on the whole molding material. In general formulae (I) and (II), n is an integer of at least 0; hydrogen atoms on the benzene ring or the naphthalene ring may be replaced by a hydrocarbon group; and R is a glycidyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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