发明名称 |
Image sensor packaging structure and method |
摘要 |
A new and improved image sensor packaging structure and method. The image sensor packaging structure includes a glass substrate. A bond pad film, on which is provided multiple, interior flip-chip bond pads and exterior BGA (ball grid array) bond pads, is provided on the glass substrate. An inverted image sensor chip is bonded to the flip-chip bond pads on the glass substrate. The light-receiving face of the chip faces the glass substrate typically through a window provided in the bond pad film. Solder bumps are provided on the BGA bond pads on the bond pad film, and bond pads on a PCB (printed circuit board) are bonded to the respective solder bumps.
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申请公布号 |
US2005236684(A1) |
申请公布日期 |
2005.10.27 |
申请号 |
US20040833713 |
申请日期 |
2004.04.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN SHOU-LUNG;LEU FANG-JUN;YU SHAN-PU |
分类号 |
H01L21/00;H01L27/146;H01L31/0203;(IPC1-7):H01L21/00;H01L31/020 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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