发明名称 Device manufacturing method
摘要 A method of manufacturing devices with device layers on both sides of a substrate according to an embodiment of the invention includes ensuring that the movements of the substrate during the exposure of the backside are a mirror image of the movements during the exposure of the frontside. In an application of such a method, positioning errors that are characteristic of direction of movement are thus reversed in the backside exposure as compared to the frontside exposure, such that the net overlay error between front and backside is zero or near zero. Embodiments of the invention may be used to reduce overlay errors arising out of certain types of positioning error at no cost, either in machine modifications or throughput.
申请公布号 US2005238970(A1) 申请公布日期 2005.10.27
申请号 US20040830408 申请日期 2004.04.23
申请人 ASML NETHERLANDS B.V. 发明人 VRIES ALEX D.
分类号 G03F7/20;G03C5/00;G03F9/00;H01L21/027;(IPC1-7):G03F9/00 主分类号 G03F7/20
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