| 摘要 |
A method and apparatus for depositing a low temperature inorganic film onto large area plastic substrates are described in this invention. Low temperature (<80° C.) inorganic films do not adhere very well to the plastic substrate. Therefore, a low temperature (<80° C.) plasma pre-treatment is added to improve the adhesion property. The inorganic film with plasma pre-treatment shows good adhesion and hermetic properties.
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