发明名称 |
Cutting segment, method of manufacturing cutting segment, and cutting tool |
摘要 |
A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
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申请公布号 |
US2005235978(A1) |
申请公布日期 |
2005.10.27 |
申请号 |
US20040010195 |
申请日期 |
2004.12.09 |
申请人 |
EHWA DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
KIM SOO-KWANG;PARK HEE-DONG |
分类号 |
B23D61/02;B24D5/12;B24D99/00;B28D1/02;B28D1/04;B28D1/12;(IPC1-7):B28D1/04 |
主分类号 |
B23D61/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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