发明名称 |
COMPONENT THAT IS SITUATED ON A COOLING FIN |
摘要 |
The invention relates to a device comprising a cooling fin that is provided with an insulation layer, on which a component is situated. The component comprises an electric contact surface. The cooling fin comprising the insulating layer and the component is provided with a layer of electrically insulating material. The electric contact surface of the component is not covered by the layer of electrically insulating material. A layer of electrically conductive material is applied to the layer of electrically insulating material and to the exposed electric contact surface of the component. |
申请公布号 |
WO2005101490(A2) |
申请公布日期 |
2005.10.27 |
申请号 |
WO2005EP51652 |
申请日期 |
2005.04.14 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;FRUEHAUF, MARKUS;GOEPFRICH, KURT |
发明人 |
FRUEHAUF, MARKUS;GOEPFRICH, KURT |
分类号 |
H01L21/50;H01L21/60;H01L23/00;H01L23/34 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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