发明名称 COMPONENT THAT IS SITUATED ON A COOLING FIN
摘要 The invention relates to a device comprising a cooling fin that is provided with an insulation layer, on which a component is situated. The component comprises an electric contact surface. The cooling fin comprising the insulating layer and the component is provided with a layer of electrically insulating material. The electric contact surface of the component is not covered by the layer of electrically insulating material. A layer of electrically conductive material is applied to the layer of electrically insulating material and to the exposed electric contact surface of the component.
申请公布号 WO2005101490(A2) 申请公布日期 2005.10.27
申请号 WO2005EP51652 申请日期 2005.04.14
申请人 SIEMENS AKTIENGESELLSCHAFT;FRUEHAUF, MARKUS;GOEPFRICH, KURT 发明人 FRUEHAUF, MARKUS;GOEPFRICH, KURT
分类号 H01L21/50;H01L21/60;H01L23/00;H01L23/34 主分类号 H01L21/50
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