| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for removing metal cores that are not desired and deposited before metallization from a substrate surface without eternally damaging a conductive path pattern-formed by design. SOLUTION: In a method for treating a plastic substrate pattern-formed on a surface by laser in order to form a core pattern suitable for later metallization, after pattern formation by laser, a substrate is made to come into contact with a process liquid suitable for removing undesired deposition that has occurred during the period of pattern formation. If the substrate pattern-formed by laser is treated with a mixture of a wetting agent and a substance that promotes cleaning before metallization, the metal cores deposited against the desire can be removed sufficiently and the conductive path pattern-formed by design is not eternally damaged. COPYRIGHT: (C)2006,JPO&NCIPI
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