发明名称 RESIN PARTICLE AND MANUFACTURING METHOD OF RESIN PARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a low-temperature decomposable resin particle which forms voids at least partially in the whole particle at a temperature of 40°C or higher and 250°C or lower, and a manufacturing method of the resin particle. SOLUTION: The resin particle forms voids at a part corresponding to 10-100 wt% of the whole particle within an hour by a chemical reaction and/or a change in states caused at a temperature of 40°C or higher and 250°C or lower. Preferably, the resin particle contains a substance having a decomposition-initiation temperature of 40°C or higher and 250°C or lower. Preferably, the resin particle contains a substance having a vaporization- and/or sublimation-initiation temperature of 40°C or higher and 250°C or lower. The manufacturing method of the resin particle comprises preparing slurry where a substance which disappears by a chemical reaction and/or a change in states caused at a temperature of 40°C or higher and 250°C or lower is suspended in a medium or a solution where the substance is dissolved in the medium and subsequently drying the medium to form particles. Preferably, the slurry or the solution is sprayed as droplets to dry the medium by spray-drying to form particles in the manufacturing method of the resin particle. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005298738(A) 申请公布日期 2005.10.27
申请号 JP20040119390 申请日期 2004.04.14
申请人 SEKISUI CHEM CO LTD 发明人 OMURA TAKAHIRO;MAENAKA HIROSHI;NAGATANI NAOYUKI
分类号 C08J3/12;(IPC1-7):C08J3/12 主分类号 C08J3/12
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