| 摘要 |
An electronic circuit board includes a first insulating base layer, a ground conductor provided on a lower surface of the first insulating base layer, an insulating thin film layer laminated and fixed on the first insulating base layer, a pair of microstrip lines, the microstrip lines being provided on an upper surface and a lower surface of the insulating thin film layer, a second insulating base layer laminated and fixed on the insulating thin film layer, a conductor pattern provided on an upper surface of the second insulating base layer, and electronic components mounted on the conductor pattern. Opposite surfaces of the microstrip lines are roughened, such that an electrical potential difference between the roughened surfaces of the microstrip lines is suppressed. Further, surfaces of the microstrip lines opposite to the roughened surfaces are substantially planarized.
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