发明名称 |
Board for printed wiring, printed wiring board, and method for manufacturing them |
摘要 |
A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 mum or less and the maximum particle diameter of which is 15 mum or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.
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申请公布号 |
US2005236182(A1) |
申请公布日期 |
2005.10.27 |
申请号 |
US20040517058 |
申请日期 |
2004.12.03 |
申请人 |
HAYASHI NORIKI;OKA YOSHIO;KANDA MASAHIKO;YAGI NARITO;MIYAZAKI KENJI;NAKATSUGI KYOUICHIROU |
发明人 |
HAYASHI NORIKI;OKA YOSHIO;KANDA MASAHIKO;YAGI NARITO;MIYAZAKI KENJI;NAKATSUGI KYOUICHIROU |
分类号 |
H05K1/09;H05K3/10;H05K3/12;H05K3/16;H05K3/24;H05K3/38;(IPC1-7):H05K1/16 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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