发明名称 |
ELECTROCHEMICAL DEPOSITION ANALYSIS SYSTEM INCLUDING HIGH-STABILITY ELECTRODE |
摘要 |
A system and method for determining concentration of one or more components of interest in a copper electroplating solution, involving repetitive electroplating and stripping of copper, in which a ruthenium electrode is employed as a substrate for such electroplating and stripping steps. The concentration determination may be carried out by pulsed cyclic galvanostatic analysis (PCGA) or other methodology, to determine levels or accelerator and/or suppresser components of the plating bath chemistry. |
申请公布号 |
WO2005100967(A2) |
申请公布日期 |
2005.10.27 |
申请号 |
WO2005US11268 |
申请日期 |
2005.04.05 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC;LIU, JUN;KING, MACKENZIE |
发明人 |
LIU, JUN;KING, MACKENZIE |
分类号 |
G01N27/26;G01N27/42 |
主分类号 |
G01N27/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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