发明名称 A heat dissipation device
摘要 A heat dissipating device 10 comprises a hollow housing 12 having an openable side. At least one heat-generating electronic device 14 lies within the housing 12 and at least one moveable clamping member 16 lies substantially within the interior of the housing 12. The device 10 also comprises a cover 18 that is moveable between open and closed positions in which it respectively opens and closes the openable side. Movement of the cover from the open to the closed position causes engagement between the cover 18 and the clamping member 16 so to clamp the electronic device 14 between the clamping member 16 and the housing 12, thereby promoting transfer of heat between the electronic device 14 and the housing 12.
申请公布号 GB0518791(D0) 申请公布日期 2005.10.26
申请号 GB20050018791 申请日期 2005.09.15
申请人 TYCO ELECTRONICS (UK) LTD 发明人
分类号 H01L23/40;H01L23/433;H05K7/20 主分类号 H01L23/40
代理机构 代理人
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