首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
CONNECTION METHOD BETWEEN CHIPS SUITED TO MULTI CHIP PACKAGE FABRICATION
摘要
申请公布号
KR20050102493(A)
申请公布日期
2005.10.26
申请号
KR20040027898
申请日期
2004.04.22
申请人
HYNIX SEMICONDUCTOR INC.
发明人
KIM, BUEM SEOK
分类号
H01L23/538;(IPC1-7):H01L23/538
主分类号
H01L23/538
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Drum Tuning Device
Device for Facilitating Stringing of a Musical Instrument
HIGH SOLIDS CONTENT SLURRIES AND METHODS
Surface mount heat sink apparatus
AGRICULTURAL VEHICLE COOLING ASSEMBLY FAN SHROUD WITH SEALS FOR PASS-THROUGH COOLING AND EXHAUST TUBES
CLAD TEXTURED METAL SUBSTRATE FOR FORMING EPITAXIAL THIN FILM THEREON AND METHOD FOR MANUFACTURING THE SAME
ELECTROMAGNETIC FORMED SHAPED CHARGE LINERS
Locking Crescent Wrench
Cooling Tube Mechanism for an I.S. Machine
Detergent supply device and washing machine having the same
Bead Furnace
ELECTRODYNAMIC METHOD
RECESSED MOUNT WITH STOWED CLAMPS
APPARATUS FOR CONNECTING FRAMING COMPONENTS OF A BUILIDING TO A FOUNDATION
HOLDER FOR A FISHING ROD
Lacquer Pattern Production Method, Lacquer Pattern Formed By Using The Method, And Lacquer Pattern Display Method
Firearm maintenance system
APPARATUS AND METHOD FOR TREATING A COMMODITY
CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODES AND METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR USING THE SAME
ELECTRONIC SENSING OF BIOLOGICAL AND CHEMICAL AGENTS USING FUNCTIONALIZED NANOSTRUCTURES
