| 摘要 |
An underside of a flat component (100) like a bare die with connectors (100a,100b) on its top side held by a holding device (110) like a sucking pipette is immersed in a layer of adhesive (130), from which the component is pressed away. A lifting device (140) with ejector pins (141) locks onto the underside of the component only partially. Independent claims are also included for the following: (a) A device for applying a layer of adhesive to flat components like bare dies, flip chips or ball grid arrays; (b) and for a device for attaching components like bare dies, flip chips or ball grid arrays on a component carrier. |
