发明名称 |
MULTILAYER PRINTED BOARD, ELECTRONIC APPARATUS, AND PACKAGING METHOD |
摘要 |
<p>A multilayer printed board comprising a plurality of capacitive coupling layers (6) each consisting of a dielectric layer (4) and a power supply layer (3) and a ground layer (5) facing each other while sandwiching the dielectric layer (4), first vias (7) connecting between the power supply layers (3) included in the plurality of capacitive coupling layers (6), and second vias (8) connecting between the ground layers (5) included in the plurality of capacitive coupling layers (6). <IMAGE></p> |
申请公布号 |
EP1589798(A1) |
申请公布日期 |
2005.10.26 |
申请号 |
EP20030815594 |
申请日期 |
2003.01.31 |
申请人 |
FUJITSU LIMITED |
发明人 |
KOYAMA, HIDEKI |
分类号 |
H01L23/498;H01P3/08;H05K1/11;H05K1/16;H05K3/42;H05K3/46;(IPC1-7):H05K3/46;H01L23/12 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|