| 摘要 |
<p>The present invention relates to a circuit board-use member which uses a flexible film having a highly precise circuit pattern, a method for forming a circuit board composed of a flexible film having a highly precise circuit pattern, and an apparatus for forming the same. <??>That is, the present invention relates to a circuit board-use member having a reinforcing plate, a removable organic layer, a flexible film having at least one circuit pattern on at least one of two surfaces, and a peeling-assist layer laminated in that order; a method for forming a circuit board by the steps of forming a circuit pattern on a surface of a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, the surface being opposite to that adhered to the reinforcing plate, and then peeling the flexible film, in which the flexible film is peeled away from the reinforcing plate while a peel angle is maintained in the range of more than 0 DEG to 80 DEG ; and an apparatus for forming a circuit board by peeling a flexible film from a flexible film substrate formed of a reinforcing plate and the flexible film which is provided with a circuit pattern and which is adhered to the reinforcing plate, the method having one of the following means: i) separation means for separating the flexible film from the reinforcing plate while the flexible film is being in contact with a curved support body; ii) curved separation means for separating the reinforcing plate from a support body for the flexible film while the reinforcing plate is being curved; and iii) moving means for relatively moving holding means and peeling means, the holding means for holding a circuit board-use member, the peeling means having a wedge-shaped peeling member for peeling the flexible film. <??>The circuit board of the present invention can be preferably used for wiring boards for electronic devices, interposers for IC packaging, wiring boards for wafer-level burn-in socket, and the like. <IMAGE></p> |
