发明名称 |
Acoustic detection of mechanically induced circuit damage |
摘要 |
An apparatus and method thereof includes at least one acoustic transducer for receiving acoustic emissions produced during a semiconductor fabrication process. The acoustic transducer is mounted to various mechanical components of a semiconductor processing equipment in a manner so that the acoustic transducer receives acoustic emissions produced during the fabrication process. The received acoustic emissions are analyzed in in-situ to identify and determine surface characteristics of the wafer.
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申请公布号 |
US6957581(B2) |
申请公布日期 |
2005.10.25 |
申请号 |
US20030695394 |
申请日期 |
2003.10.29 |
申请人 |
INFINEON TECHNOLOGIES RICHMOND, LP |
发明人 |
GILGUNN PETER |
分类号 |
H01L21/00;(IPC1-7):G01N29/24;G01N29/26 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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