发明名称 |
Apparatus for and method for polishing workpiece |
摘要 |
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
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申请公布号 |
USRE38854(E1) |
申请公布日期 |
2005.10.25 |
申请号 |
US20020142980 |
申请日期 |
2002.05.13 |
申请人 |
EBARA CORPORATION |
发明人 |
NAKASHIBA MASAMICHI;KIMURA NORIO;WATANABE ISAMU;YOSHIDA KAORI |
分类号 |
B24B5/00;B24B37/04;B24B49/16;(IPC1-7):B24B5/00 |
主分类号 |
B24B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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