发明名称 Method for manufacturing semiconductor device
摘要 The invention provides a method for manufacturing a semiconductor device by which product performance and working efficiency can be improved while increasing a capacitor area of cross-point FeRAM. By using a first mask formed on a lower electrode layer forming film, a lower electrode is formed and processed and the lower electrode 2 A can be exposed on a first insulating layer. By using a second mask formed on an upper electrode supporting layer forming film, a ferroelectric layer and an upper electrode supporting layer can be formed and processed and the upper electrode supporting layer can be exposed on a second insulating layer.
申请公布号 US6958293(B2) 申请公布日期 2005.10.25
申请号 US20040849148 申请日期 2004.05.20
申请人 SEIKO EPSON CORPORATION 发明人 FUKADA SHINICHI
分类号 H01L27/105;H01L21/00;H01L21/8246;H01L27/10;(IPC1-7):H01I21/44 主分类号 H01L27/105
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