| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of electronic components such as a piezoelectric vibrator and a piezoelectric oscillator. SOLUTION: In the manufacturing method of the piezoelectric vibrator, the piezoelectric vibrator is configured such that a piezoelectric blank plate is supported on a conductive pad on an insulating substrate inside of a piezoelectric vibrator package in a cantilever state via electrodes and hermetically sealed. The method includes the steps of: applying conductive adhesive to either of an insulating substrate side electrode and a piezoelectric blank plate side electrode or to both of the insulating substrate side electrode and the piezoelectric blank plate side electrode; placing the piezoelectric blank plate on the insulating substrate; and curing the conductive adhesive by heating the insulating substrate and the piezoelectric blank plate, and also in the method, nano paste or solder paste is used for the applied conductive adhesive to attain the purpose above. COPYRIGHT: (C)2006,JPO&NCIPI
|
