| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold releasing material for a printed circuit board which does not adsorb contamination owing to the absence of static electricity, is not deformed thermally even when pressed at a high temperature and at a high pressure, and has a good mold releasing property in a press process for producing the resin base printed circuit board. SOLUTION: In the mold releasing material for the resin base printed circuit board, a mold releasing layer containing a polymer (A) obtained from 5-90 wt.% of a monomer (a) having a carbon-carbon unsaturated double bond and a fluoroalkyl group, 5-50 wt.% of a monomer (b) having a carbon-carbon unsaturated double bond and a crosslonkable functional group, and 0-90 wt.% of a monomer (c) having a carbon-carbon unsaturated double bond other than that of the monomer (a) or the monomer (b) and a polymer (B) obtained from 5-50 wt.% of the monomer (b) and 50-95 wt.% of the monomer (c) is formed at least on one side of a substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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