| 摘要 |
PROBLEM TO BE SOLVED: To provide a means by which, as a circuit for a printed circuit board or the like, an extra-thin film circuit suitable for the increase of density can inexpensively and securely be formed by an extremely simple process, and which is friendly to the environment and can contribute to resource economization as well. SOLUTION: The surface of a high polymer base material 1 is irradiated with laser light L along a circuit pattern. Thus, the chemically bonded parts in the high polymer are selectively dissociated to modify the surface part of the base material 1 in the irradiated area Z into the hydrophilic one, and a metallic thin film 3 is formed on the irradiated area Z by electroless plating. COPYRIGHT: (C)2006,JPO&NCIPI
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