| 摘要 |
<p>An epoxy resin composition for semiconductor encapsulation which comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) an oxidized polyethylene wax having a dropping point of 60 to 140°C, acid value of 10 to 100 mg-KOH/g, number-average molecular weight of 500 to 20,000, and average particle diameter of 5 to 100 mum, wherein at least either of the epoxy resin (A) and the phenolic resin (B) is a resin of a novolak structure having a biphenylene group in the main chain and the oxidized polyethylene wax (E) is contained in an amount of 0.01 to 1 wt.% based on the whole epoxy resin composition.</p> |
