| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which can remove exactly a smear generated on the front surface conductor of a core substrate in the method of manufacturing a build-up wiring board using the core substrate made of ceramics. SOLUTION: The method of manufacturing the wiring board includes a desmear treating step of removing a resin residue in a via with an alkaline potassium permanganate solution 40, and a cleaning step of cleaning in the via 34 to be sequentially performed. In the cleaning step, the inside of the via 34 is cleaned with a cleaning liquid 42 containing a nitric acid, a hydrofluoric acid and pure water. Then, the pure water 44 is further injected toward the bottom of the via 34. COPYRIGHT: (C)2006,JPO&NCIPI |
