发明名称 |
Method of fabricating microelectromechanical system structures |
摘要 |
A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
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申请公布号 |
US2005233543(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20040827945 |
申请日期 |
2004.04.20 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
WEI JUN;WONG STEPHEN C.K.;WU YONGLING;NG FERN L. |
分类号 |
B81C3/00;H01L21/20;H01L21/30;H01L21/46;H01L21/76;(IPC1-7):H01L21/76 |
主分类号 |
B81C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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