发明名称 |
Light emitting device, manufacturing method thereof, and electronic apparatus |
摘要 |
Further reduction in frame portion is achieved in the case where a driver circuit and a pixel portion are formed on a common substrate. Also, a light emitting device is provided with an advantageous structure for obtaining a large number of panels by use of a large substrate, whereby the number of panels taken out from a substrate can be increased, leading to better productivity. According to the invention, a terminal electrode is provided in the position overlapping a peripheral circuit portion, and the terminal electrode is connected to an FPC with an anisotropic conductive adhesive material. In addition, a covering material is firmly fixed by using a sealant that is in contact with the edge and periphery of a substrate.
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申请公布号 |
US2005231107(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050099654 |
申请日期 |
2005.04.06 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;OSAME MITSUAKI;KOYAMA JUN |
分类号 |
G09G3/30;H01L27/32;H01L51/52;H05B33/02;H05B33/06;H05B33/08;H05B33/10;H05B33/14;(IPC1-7):H05B33/06 |
主分类号 |
G09G3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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